Ansys ANSS announced a partnership with TSMC and Microsoft to develop a solution to analyze mechanical stress in multi-die 3D-IC systems produced using TSMC's 3DFabric advanced packaging. This ...
PITTSBURGH, Feb. 11, 2025 /PRNewswire/ -- Ansys (NASDAQ: ANSS) and Concepts NREC have partnered to deliver an automated workflow that connects design tools with robust analysis tools for ...
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